There are a number of nanopositioning solutions for photonics packaging currently on the market, however each has its fatal flaw that keeps it from being the optimal solution. As a former customer, t.enable’s first-hand knowledge of the strengths and weaknesses of all the major competition has driven a development effort to combine the collective advantages of the competition into a single product.

Extremely fast, large-area first-light searches which translates into shorter manufacturing-line cycle times.

Large in-situ workspace – 20mm x 20mm x 20mm – which implies cost-effective, low resolution material handling solutions and simplified system assembly.

Minimal footprint facilitating multiple units in a single manufacturing-line cell and hence much lower capital equipment overhead and increased throughput.

Inherent force feedback enabling process optimization in various ways such as controlled epoxy bonding steps and bump & feel locating.

High electromechanical stiffness coupled with high dynamic bandwidth allows for control of laser welding processes thereby minimizing post-weld shift and eliminating costly package re-work steps.

Increased system reliability by employing a single-axis, single-actuator design which dramatically decreases the number of system components.